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NCS2502 650 mA 110 MHz Current Feedback Op Amp with Enable Feature
NCS2502 is a 650 mA 110MHz current feedback monolithic operational amplifier featuring high slew rate and low differential gain and phase error. The current feedback architecture allows for a superior bandwidth and low power consumption. This device features an enable pin.
Features http://onsemi.com MARKING DIAGRAMS
8 8 1 SO-8 D SUFFIX CASE 751 1 4 12 3 SC-70-6 (SC-88) SQ SUFFIX CASE 419B 6 YA2M G 1 6 6 1 SOT23-6 (TSOP-6) SN SUFFIX CASE 318G YA2, N2502 A L Y W
M
* * * * * * * * * * * * * *
-3.0 dB Small Signal BW (AV = +2.0, VO = 0.5 Vp-p) 110 MHz Typ Slew Rate 230 V/ms Supply Current 650 mA Input Referred Voltage Noise 5 nV/ Hz THD -49 dB (f = 5.0 MHz, VO = 2.0 Vp-p) Output Current 80 mA Enable Pin Available Pin Compatible with EL5160, MAX4452 Pb-Free Packages are Available Portable Video Line Drivers Radar/Communication Receivers Set Top Box NTSC/PAL/HDTV
3 2
Gain = +2 RF = 1.2kW RL = 100W
N2502 ALYW G
6
5
Applications
YA2AYW G 1
NORMAILIZED GAIN(dB)
VS = 5.0V VOUT = 0.5V
1 0 -1 -2 -3 -4 -5
VS = 2.5V VOUT = 0.5V
G
= NCS2502 = Assembly Location = Wafer Lot = Year = Work Week = Date Code = Pb-Free Package
SO-8 PINOUT NC -IN +IN VEE 1 2 3 4 (Top View) SOT23-6/SC70-6 PINOUT - + 8 7 6 5 EN VCC OUT NC
VS = 2.5V VOUT = 2.0V VS = 5.0V VOUT = 2.0V VS = 2.5V VOUT = 1.0V
-6 0.01
VS = 5.0V VOUT = 1.0V 100 1000
0.1
10 1 FREQUENCY (MHz)
OUT VEE +IN
1 + 2 3 (Top View) -
6 5 4
VCC EN -IN
Figure 1. Frequency Response: Gain (dB) vs. Frequency Av = +2.0
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 13 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2005
1
November, 2005 - Rev. 2
Publication Order Number: NCS2502/D
NCS2502
PIN FUNCTION DESCRIPTION
Pin (SO-8) 6 Pin (SOT23/SC70) 1 Symbol OUT Function Output Equivalent Circuit
VCC ESD OUT
VEE
4 3
2 3
VEE +IN
Negative Power Supply Non-inverted Input
ESD +IN VCC
ESD -IN
VEE
2 7 8
4 6 5
-IN VCC EN
Inverted Input Positive Power Supply Enable
EN
See Above
VCC ESD
VEE
1, 5
N/A
NC
No Connect
ENABLE PIN TRUTH TABLE
High* Enable *Default open state
VCC
Low Disabled
Enabled
+IN -IN
OUT
CC
VEE
Figure 2. Simplified Device Schematic http://onsemi.com
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NCS2502
ATTRIBUTES
Characteristics ESD Human Body Model Machine Model Charged Device Model Moisture Sensitivity (Note 2) Flammability Rating Oxygen Index: 28 to 34 Value 2.0 kV (Note 1) 200 V 1.0 kV Level 1 UL 94 V-0 @ 0.125 in
1. 0.8 kV between the input pairs +IN and -IN pins only. All other pins are 2.0 kV. 2. For additional information, see Application Note AND8003/D.
MAXIMUM RATINGS
Parameter Power Supply Voltage Input Voltage Range Input Differential Voltage Range Output Current Maximum Junction Temperature (Note 3) Operating Ambient Temperature Storage Temperature Range Power Dissipation Thermal Resistance, Junction-to-Air SO-8 SC70-6 SOT23-6 Symbol VS VI VID IO TJ TA Tstg PD RqJA 172 215 154 Rating 11 vVS vVS 100 150 -40 to +85 -60 to +150 (See Graph) Unit VDC VDC VDC mA C C C mW C/W
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 3. Power dissipation must be considered to ensure maximum junction temperature (TJ) is not exceeded.
MAXIMUM POWER DISSIPATION
1400 Maximum Power Dissapation (mW) 1200 SO-8 Pkg SOT23 Pkg
The maximum power that can be safely dissipated is limited by the associated rise in junction temperature. For the plastic packages, the maximum safe junction temperature is 150C. If the maximum is exceeded momentarily, proper circuit operation will be restored as soon as the die temperature is reduced. Leaving the device in the "overheated'' condition for an extended period can result in device damage.
1000 800 600 SC70 Pkg 400 200 0 -50
-25
0
50 75 25 100 Ambient Temperature (C)
125
150
Figure 3. Power Dissipation vs. Temperature
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NCS2502
AC ELECTRICAL CHARACTERISTICS (VCC = +5.0 V, VEE = -5.0 V, TA = -40C to +85C, RL = 100 W to GND, RF = 1.2 kW, AV = +2.0, Enable is left open, unless otherwise specified).
Symbol Characteristic Conditions Min Typ Max Unit FREQUENCY DOMAIN PERFORMANCE BW Bandwidth 3.0 dB Small Signal 3.0 dB Large Signal 0.1 dB Gain Flatness Bandwidth Differential Gain Differential Phase MHz AV = +2.0, VO = 0.5 Vp-p AV = +2.0, VO = 2.0 Vp-p AV = +2.0 AV = +2.0, RL = 150 W, f = 3.58 MHz AV = +2.0, RL = 150 W, f = 3.58 MHz 110 90 15 0.08 0.2 MHz %
GF0.1dB dG dP
TIME DOMAIN RESPONSE SR ts Slew Rate Settling Time 0.01% 0.1% Rise and Fall Time Turn-on Time Turn-off Time AV = +2.0, Vstep = 2.0 V AV = +2.0, Vstep = 2.0 V AV = +2.0, Vstep = 2.0 V (10%-90%) AV = +2.0, Vstep = 2.0 V 230 160 35 9.0 900 400 ns ns ns V/ms ns
tr tf tON tOFF
HARMONIC/NOISE PERFORMANCE THD HD2 HD3 IP3 SFDR eN iN Total Harmonic Distortion 2nd Harmonic Distortion 3rd Harmonic Distortion Third-Order Intercept Spurious-Free Dynamic Range Input Referred Voltage Noise Input Referred Current Noise f = 5.0 MHz, VO = 2.0 Vp-p, RL = 150 W f = 5.0 MHz, VO = 2.0 Vp-p f = 5.0 MHz, VO = 2.0 Vp-p f = 10 MHz, VO = 2.0 Vp-p f = 5.0 MHz, VO = 2.0 Vp-p f = 1.0 MHz f = 1.0 MHz, Inverting f = 1.0 MHz, Non-Inverting -49 -57 -53 35 55 5 25 25 dB dBc dBc dBm dBc
nV pA
Hz Hz
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NCS2502
DC ELECTRICAL CHARACTERISTICS (VCC = +5.0 V, VEE = -5.0 V, TA = -40C to +85C, RL = 100 W to GND, RF = 1.2 kW, AV = +2.0, Enable is left open, unless otherwise specified).
Symbol Characteristic Conditions Min Typ Max Unit DC PERFORMANCE VIO DVIO/DT IIB DIIB/DT VIH VIL Input Offset Voltage Input Offset Voltage Temperature Coefficient Input Bias Current Input Bias Current Temperature Coefficient Input High Voltage (Enable) (Note 4) Input Low Voltage (Enable) (Note 4) +Input (Non-Inverting), VO = 0 V -Input (Inverting), VO = 0 V (Note 4) +Input (Non-Inverting), VO = 0 V -Input (Inverting), VO = 0 V VCC-1.5 V VCC-3.5 V -20 -20 -8.0 0 6.0 "3.0 "0.4 +40 -10 +20 +20 +8.0 mV mV/C mA nA/C V V
INPUT CHARACTERISTICS VCM CMRR RIN CIN Input Common Mode Voltage Range (Note 4) Common Mode Rejection Ratio Input Resistance Differential Input Capacitance (See Graph) +Input (Non-Inverting) -Input (Inverting) "3.0 50 "4.0 55 4 350 1.0 V dB MW W pF
OUTPUT CHARACTERISTICS ROUT VO IO Output Resistance Output Voltage Swing Output Current "3.0 "40 0.03 "3.5 "80 W V mA
POWER SUPPLY VS IS,ON IS,OFF PSRR Operating Voltage Supply Power Supply Current - Enabled Power Supply Current - Disabled Power Supply Rejection Ratio VO = 0 V VO = 0 V (See Graph) 0.4 0 50 10 0.65 0.04 60 1.2 0.3 V mA mA dB
4. Guaranteed by design and characterization.
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NCS2502
AC ELECTRICAL CHARACTERISTICS (VCC = +2.5 V, VEE = -2.5 V, TA = -40C to +85C, RL = 100 W to GND, RF = 1.2 kW, AV = +2.0, Enable is left open, unless otherwise specified).
Symbol Characteristic Conditions Min Typ Max Unit FREQUENCY DOMAIN PERFORMANCE BW Bandwidth 3.0 dB Small Signal 3.0 dB Large Signal 0.1 dB Gain Flatness Bandwidth Differential Gain Differential Phase MHz AV = +2.0, VO = 0.5 Vp-p AV = +2.0, VO = 2.0 Vp-p AV = +2.0 AV = +2.0, RL = 150 W, f = 3.58 MHz AV = +2.0, RL = 150 W, f = 3.58 MHz 110 70 10 0.08 0.2 MHz %
GF0.1dB dG dP
TIME DOMAIN RESPONSE SR ts Slew Rate Settling Time 0.01% 0.1% Rise and Fall Time Turn-on Time Turn-off Time AV = +2.0, Vstep = 1.0 V AV = +2.0, Vstep = 1.0 V AV = +2.0, Vstep = 1.0 V (10%-90%) AV = +2.0, Vstep = 1.0 V 180 155 25 8.0 900 400 ns ns ns V/ms ns
tr tf tON tOFF
HARMONIC/NOISE PERFORMANCE THD HD2 HD3 IP3 SFDR eN iN Total Harmonic Distortion 2nd Harmonic Distortion 3rd Harmonic Distortion Third-Order Intercept Spurious-Free Dynamic Range Input Referred Voltage Noise Input Referred Current Noise f = 5.0 MHz, VO = 1.0 Vp-p, RL = 150 W f = 5.0 MHz, VO = 1.0 Vp-p f = 5.0 MHz, VO = 1.0 Vp-p f = 10 MHz, VO = 1.0 Vp-p f = 5.0 MHz, VO = 1.0 Vp-p f = 1.0 MHz f = 1.0 MHz, Inverting f = 1.0 MHz, Non-Inverting -49 -57 -53 35 55 5 25 25 dB dBc dBc dBm dBc
nV pA
Hz Hz
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NCS2502
DC ELECTRICAL CHARACTERISTICS (VCC = +2.5 V, VEE = -2.5 V, TA = -40C to +85C, RL = 100 W to GND, RF = 1.2 kW, AV = +2.0, Enable is left open, unless otherwise specified).
Symbol Characteristic Conditions Min Typ Max Unit DC PERFORMANCE VIO DVIO/DT IIB DIIB/DT VIH VIL Input Offset Voltage Input Offset Voltage Temperature Coefficient Input Bias Current Input Bias Current Temperature Coefficient Input High Voltage (Enable) (Note 5) Input Low Voltage (Enable) (Note 5) +Input (Non-Inverting), VO = 0 V -Input (Inverting), VO = 0 V (Note 5) +Input (Non-Inverting), VO = 0 V -Input (Inverting), VO = 0 V VCC-1.5 V VCC-3.5 V -20 -20 -8.0 0 6.0 "3.0 "0.4 +40 -10 +20 +20 +8.0 mV mV/C mA nA/C V V
INPUT CHARACTERISTICS VCM CMRR RIN CIN Input Common Mode Voltage Range (Note 5) Common Mode Rejection Ratio Input Resistance Differential Input Capacitance (See Graph) +Input (Non-Inverting) -Input (Inverting) "1.3 50 "1.5 55 4 350 1.0 V dB MW W pF
OUTPUT CHARACTERISTICS ROUT VO IO Output Resistance Output Voltage Swing Output Current "1.1 "40 0.02 "1.4 "80 W V mA
POWER SUPPLY VS IS,ON IS,OFF PSRR Operating Voltage Supply Power Supply Current - Enabled Power Supply Current - Disabled Power Supply Rejection Ratio VO = 0 V VO = 0 V (See Graph) 0.3 0 50 5.0 0.55 0.04 60 1.1 0.3 V mA mA dB
5. Guaranteed by design and characterization. VIN + -
VOUT
RF RF
RL
Figure 4. Typical Test Setup (AV = +2.0, RF = 1.8 kW or 1.2 kW or 1.0 kW, RL = 100 W)
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NCS2502
3 2 NORMAILIZED GAIN(dB) 1 0 -1 -2 -3 -4 -5 -6 0.01 VS = 5.0V VOUT = 1.0V 0.1 Gain = +2 RF = 1.2kW RL = 100W VS = 5.0V VOUT = 0.5V VS = 2.5V VOUT = 0.5V 6 3 0 -3 -6 -9 100 1000 -12 0.01 Gain = +1 RF = 1.2kW RL = 100W VS = 5.0V VOUT = 0.7V
NORMALIZED GAIN (dB)
VS = 2.5V VOUT = 1.0V VS = 5.0V VOUT = 1.0V VS = 2.5V VOUT = 1.0V VS = 2.5V VOUT = 0.7V VS = 5.0V VOUT = 1.0V
VS = 2.5V VOUT = 2.0V VS = 5V VOUT = 2.0V VS = 2.5V VOUT = 1.0V
1 10 FREQUENCY (MHz)
0.10
1 10 FREQUENCY (MHz)
100
1000
Figure 5. Frequency Response: Gain (dB) vs. Frequency Av = +2.0
6 NORMAILIZED GAIN(dB) 3 0 -3 -6 -9 -12 0.01 VOUT = 2.0V RL = 100W 0.10 VS = 2.5V AV = +2 VS = 5V AV = +2 VS = 2.5V AV = +4 1 10 FREQUENCY (MHz) 100 1000 VS = 5V AV = +4 6 3 0 -3 -6 -9 -12 0.01
Figure 6. Frequency Response: Gain (dB) vs. Frequency Av = +1.0
NORMALIZED GAIN (dB)
VS = 5.0V AV = +2
VS = 2.5V AV = +4 VS = 5.0V AV = +4 VS = 2.5V AV = +2 10 1 FREQUENCY (MHz) 100 1000
VOUT = 0.5V RL = 100W 0.10
Figure 7. Large Signal Frequency Response Gain (dB) vs. Frequency
Figure 8. Small Signal Frequency Response Gain (dB) vs. Frequency
Figure 9. Small Signal Step Response Vertical: 500 mV/div Horizontal: 10 ns/div
Figure 10. Large Signal Step Response Vertical: 1 V/div Horizontal: 10 ns/div
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NCS2502
-30 -35 -40 DISTORTION (dB) -45 -50 -55 -60 -65 -70 -75 -80 1 10 FREQUENCY (MHz) 100 -70 0.5 1 1.5 2 2.5 VOUT (VPP) 3 3.5 4 HD2 THD HD3 VS = 5V f = 5MHz RL = 150W -40 -45 DISTORTION (dB) -50 HD3 -55 -60 -65 HD2 THD VS = 5V VOUT= 2VPP RL = 150W
Figure 11. THD and Harmonic Distortion (dB) vs Frequency (MHz)
Figure 12. THD and Harmonic Distortion (dB) vs Output Voltage (VPP)
8 VOLTAGE NOISE (nV/pHz) 7 6 5 4 3 2 1 0 1 10 100 FREQUENCY (kHz) 1000 CMRR (dB) VS = 5V
-20 -25 -30 -35 -40 -45 -50 -55 -60 -65 10k 100k 1M FREQUENCY (Hz) 10M 100M VS = 5V
Figure 13. Input Referred Noise vs. Frequency
Figure 14. CMRR vs. Frequency
0 DIFFERENTIAL GAIN (%) -10 -20 PSRR(dB) -30 -40 -50 -60 -70 0.01 +5.0V -2.5V -5.0V 0.1 1 FREQUENCY (MHz) 10 100 +2.5V
0.1 0.08 0.06 0.04 0.02 0 -0.02 -0.04 -0.06 -0.08 -0.1 -0.8 -0.6 0.4 0.2 -0.4 -0.2 0 OFFSET VOLTAGE (V) 0.6 0.8 10MHz 4.43MHz 3.58MHz VS = 5V RL = 150W
Figure 15. PSRR vs. Frequency
Figure 16. Differential Gain
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NCS2502
0.3 DIFFERENTIAL PHASE () 0.2 0.1 3.58MHz 0 -0.1 -0.2 10MHz -0.3 -0.8 0.3 -0.6 0.4 0.2 -0.4 -0.2 0 OFFSET VOLTAGE (V) 0.6 0.8 4 5 6 7 9 8 SUPPLY VOLTAGE (V) 10 11 VS = 5V RL = 150W CURRENT (mA) 0.9 0.8 0.7 0.6 -40C 0.5 0.4 85C 25C
4.43MHz
Figure 17. Differential Phase
Figure 18. Supply Current vs. Power Supply (Enabled)
0.12 85C OUTPUT VOLTAGE (VPP) 0.1 CURRENT (mA) 0.08 0.06 0.04 0.02 0 4 5 6 8 7 9 SUPPLY VOLTAGE (V) 10 11 25C -40C
8 7 6 85C 5 4 3 2 4 5 6 8 7 9 SUPPLY VOLTAGE (V) 10 11 -40C 25C
Figure 19. Supply Current vs. Temperature (Disabled)
Figure 20. Output Voltage Swing vs. Supply Voltage
9 OUTPUT RESISTANCE (W) 8 OUTPUT VOLTAGE (VPP) 7 6 5 4 3 2 1 0 1 10 100 1000 LOAD RESISTANCE (W) 10k AV = +2 f = 1MHz VS = 2.5V VS = 5V
100 VS = 5V 10
1
0.1
0.01 0.01
0.1
1 10 FREQUENCY (MHz)
100
Figure 21. Output Voltage Swing vs. Load Resistance
Figure 22. Output Resistance vs. Frequency
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NCS2502
18 12 6 Gain(dB) 0 -6 -12 -18 -24 -30 1 10 100 Frequency (MHz) 1000 VS = 5V RF = 1.2kW RL = 100W Gain= +2 100pF TRANSIMPEDANCE (W) 10M 1M VS = 5V
100k 10k 1k 100 10 1 0.01 0.1 1 100 10 FREQUENCY (MHz) 1000 10k
47pF 10pF
Figure 23. Frequency Response vs. CL
Figure 24. Transimpedance (ROL) vs. Frequency
EN
OUT
EN OUT
Output Signal: Squarewave, 10MHz, 2VPP
Output Signal: Squarewave, 10MHz, 2VPP
Figure 25. Turn ON Time Delay Horizontal: 4 ns / Div Vertical: 10mV/Div
Figure 26. Turn OFF Time Delay Horizontal: 4 ns / Div Vertical: 10mV/Div
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NCS2502
General Design Considerations
The current feedback amplifier is optimized for use in high performance video and data acquisition systems. For current feedback architecture, its closed-loop bandwidth depends on the value of the feedback resistor. The closed-loop bandwidth is not a strong function of gain, as is for a voltage feedback amplifier, as shown in Figure 27.
10 5 0 -5
resistor too far below its recommended value will cause overshoot, ringing, and eventually oscillation. Since each application is slightly different, it is worth some experimentation to find the optimal RF for a given circuit. A value of the feedback resistor that produces X0.1 dB of peaking is the best compromise between stability and maximal bandwidth. It is not recommended to use a current feedback amplifier with the output shorted directly to the inverting input.
Printed Circuit Board Layout Techniques
RF = 1 kW RF = 1.2 kW RF = 1.8 kW AV = +2 VCC = +5 V VEE = -5 V 0.1 1.0 10 100 1000 10000
-10 -15
-20 0.01
Proper high speed PCB design rules should be used for all wideband amplifiers as the PCB parasitics can affect the overall performance. Most important are stray capacitances at the output and inverting input nodes as it can effect peaking and bandwidth. A space (3/16 is plenty) should be left around the signal lines to minimize coupling. Also, signal lines connecting the feedback and gain resistors should be short enough so that their associated inductance does not cause high frequency gain errors. Line lengths less than 1/4 are recommended.
Video Performance
GAIN (dB)
FREQUENCY (MHz)
Figure 27. Frequency Response vs. RF
The -3.0 dB bandwidth is, to some extent, dependent on the power supply voltages. By using lower power supplies, the bandwidth is reduced, because the internal capacitance increases. Smaller values of feedback resistor can be used at lower supply voltages, to compensate for this affect.
Feedback and Gain Resistor Selection for Optimum Frequency Response
This device designed to provide good performance with NTSC, PAL, and HDTV video signals. Best performance is obtained with back terminated loads as performance is degraded as the load is increased. The back termination reduces reflections from the transmission line and effectively masks transmission line and other parasitic capacitances from the amplifier output stage.
ESD Protection
A current feedback operational amplifier's key advantage is the ability to maintain optimum frequency response independent of gain by using appropriate values for the feedback resistor. To obtain a very flat gain response, the feedback resistor tolerance should be considered as well. Resistor tolerance of 1% should be used for optimum flatness. Normally, lowering RF resistor from its recommended value will peak the frequency response and extend the bandwidth while increasing the value of RF resistor will cause the frequency response to roll off faster. Reducing the value of RF
This device is protected against electrostatic discharge (ESD) on all pins as specified in the attributes table. Note: Human Body Model for +IN and -IN pins are rated at 0.8 kV while all other pins are rated at 2.0 kV. Under closed-loop operation, the ESD diodes have no effect on circuit performance. However, under certain conditions the ESD diodes will be evident. If the device is driven into a slewing condition, the ESD diodes will clamp large differential voltages until the feedback loop restores closed-loop operation. Also, if the device is powered down and a large input signal is applied, the ESD diodes will conduct.
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NCS2502
ORDERING INFORMATION
Device NCS2502SQT2G* NCS2502SNT1G NCS2502DG NCS2502DR2G Package SC70-6 (SC88) (Pb-Free) SOT23-6 (TSOP-6) (Pb-Free) SO-8 (Pb-Free) SO-8 (Pb-Free) Shipping 3000 Tape & Reel 3000 Tape & Reel 98 Units/Rail 2500 Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *Contact ON Semiconductor for ordering information.
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NCS2502
PACKAGE DIMENSIONS
SO-8 D SUFFIX CASE 751-07 ISSUE AG
-X- A
8 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244
B
1 4
S
0.25 (0.010)
M
Y
M
-Y- G C -Z- H D 0.25 (0.010)
M SEATING PLANE
K
N
X 45 _
0.10 (0.004)
M
J
ZY
S
X
S
DIM A B C D G H J K M N S
SOLDERING FOOTPRINT*
1.52 0.060 7.0 0.275 4.0 0.155
0.6 0.024
1.270 0.050
SCALE 6:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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NCS2502
PACKAGE DIMENSIONS
SC-70-6 (SC-88) SQ SUFFIX CASE 419B-02 ISSUE 02
A G
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419B-01 OBSOLETE, NEW STANDARD 419B-02. 4 INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --- 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --- 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20
6
5
S
1 2 3
-B-
D 6 PL 0.2 (0.008)
M
B N
M
DIM A B C D G H J K N S
J C
H
K
SOLDERING FOOTPRINT*
0.50 0.0197
0.65 0.025 0.65 0.025 0.40 0.0157
1.9 0.0748
SCALE 20:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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NCS2502
PACKAGE DIMENSIONS
SOT23-6 (TSOP-6) SN SUFFIX CASE 318G-02 ISSUE M
A L
6 5 1 2 4 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MILLIMETERS DIM MIN MAX A 2.90 3.10 B 1.30 1.70 C 0.90 1.10 D 0.25 0.50 G 0.85 1.05 H 0.013 0.100 J 0.10 0.26 K 0.20 0.60 L 1.25 1.55 M 0_ 10 _ S 2.50 3.00 INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0_ 10 _ 0.0985 0.1181
S
B
D G M 0.05 (0.002) H C K J
SOLDERING FOOTPRINT*
2.4 0.094
1.9 0.075
0.95 0.037 0.95 0.037
0.7 0.028 1.0 0.039
SCALE 10:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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NCS2502/D

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